? semiconductor components industries, llc, 2015 january, 2015 ? rev. 11 1 publication order number: mmqa/d mmqa, szmmqa quad common anode series sc-74 quad monolithic common anode transient voltage suppressors for esd protection this quad monolithic silicon voltage suppressor is designed for applications requiring transient overvoltage protection capability. it is intended for use in voltage and esd sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applications. its quad junction common anode design protects four separate lines using only one package. these devices are ideal for situations where board space is at a premium. features ? sc?74 package allows four separate unidirectional configurations ? peak power ? min. 24 w @ 1.0 ms (unidirectional), per figure 5 waveform ? peak power ? min. 150 w @ 20 s (unidirectional), per figure 6 waveform ? maximum clamping voltage @ peak pulse current ? low leakage < 2.0 a ? esd rating of class 3b (exceeding 16 kv) per the human body model ? sz prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these devices are pb?free and are rohs compliant* *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. pin 1. cathode 2. anode 3. cathode 4. cathode 5. anode 6. cathode 1 2 3 6 5 4 marking diagram pin assignment sc?74 case 318f style 1 xxxm www. onsemi.com xxx = specific device code m = date cade = pb?free package (note: microdot may be in either location) sc?74 quad transient voltage suppressor 24 watts peak power 5.6 ? 33 volts device marking & ordering information see specific marking and ordering information in the device marking and ordering information table on page 6 of this data sheet.
mmqa, szmmqa quad common anode series www. onsemi.com 2 thermal characteristics (t a = 25 c unless otherwise noted) characteristic symbol value unit peak power dissipation @ 1.0 ms (note 1) @ t a 25 c p pk 24 w peak power dissipation @ 20 s (note 2) @ t a 25 c p pk 150 w total power dissipation on fr-5 board (note 3) @ t a = 25 c p d 225 1.8 mw mw/ c thermal resistance from junction ? to ? ambient r ja 556 c/w total power dissipation on alumina substrate (note 4) @ t a = 25 c derate above 25 c p d 300 2.4 mw mw/ c thermal resistance from junction ? to ? ambient r ja 417 c/w junction and storage temperature range t j , t stg ? 55 to +150 c lead solder temperature ? maximum (10 second duration) t l 260 c 1. non-repetitive current pulse per figure 5 and derate above t a = 25 c per figure 4. 2. non-repetitive current pulse per figure 6 and derate above t a = 25 c per figure 4. 3. fr-5 = 1.0 x 0.75 x 0.62 in. 4. alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina electrical characteristics (t a = 25 c unless otherwise noted) unidirectional (circuit tied to pins 1, 2, and 5; pins 2, 3, and 5; pins 2, 4, and 5; or pins 2, 5, and 6) (v f = 0.9 v max @ i f = 10 ma) device (note 5) breakdown voltage max reverse leakage current max zener impedance (note 7) max reverse surge current max reverse voltage @ i rsm (note 8) (clamping voltage) maximum temperature coefficient of v z capacitance @ 0 volt bias, 1 mhz v zt (note 6) (v) @ i zt i r v r (pf) min nom max (ma) (na) (v) z zt @ i zt ( ) (ma) i rsm (a) v rsm (v) (mv/ c) min max mmqa5v6t1g 5.32 5.6 5.88 1.0 2000 3.0 400 3.0 8.0 1.26 ? ? mmqa6v2t1g/t3g 5.89 6.2 6.51 1.0 700 4.0 300 2.66 9.0 10.6 ? ? mmqa6v8t1g 6.46 6.8 7.14 1.0 500 4.3 300 2.45 9.8 10.9 100 250 mmqa12vt1g 11.4 12 12.6 1.0 75 9.1 80 1.39 17.3 14 ? ? mmqa13vt1g 12.4 13 13.7 1.0 75 9.8 80 1.29 18.6 15 ? ? mmqa15vt1g 14.3 15 15.8 1.0 75 11 80 1.1 21.7 16 ? ? mmqa18vt1g 17.1 18 18.9 1.0 75 14 80 0.923 26 19 ? ? mmqa20vt1g/t3g 19 20 21 1.0 75 15 80 0.84 28.6 20.1 ? ? MMQA22VT1G 20.9 22 23.1 1.0 75 17 80 0.758 31.7 22 ? ? mmqa24vt1g 22.8 24 25.2 1.0 75 18 100 0.694 34.6 25 ? ? mmqa27vt1g 25.7 27 28.4 1.0 75 21 125 0.615 39 28 ? ? mmqa33vt1g 31.4 33 34.7 1.0 75 25 200 0.504 48.6 37 ? ? 5. includes sz-prefix devices where applicable. 6. v z measured at pulse test current i t at an ambient temperature of 25 c. 7. z zt is measured by dividing the ac voltage drop across the device by the ac current supplied. the specified limits are i z(ac) = 0.1 i z(dc) , with ac frequency = 1 khz. 8. surge current waveform per figure 5 and derate per figure 4.
mmqa, szmmqa quad common anode series www. onsemi.com 3 typical characteristics 300 v z , nominal zener voltage (v) c, capacitance (pf) 250 200 150 100 50 0 5.6 6.8 12 20 27 biased at 0 v biased at 1 v biased at 50% of v z nom figure 1. typical capacitance 5.6 6.8 20 27 10,000 1,000 100 10 0 figure 2. typical leakage current i r , leakage (na) v z , nominal zener voltage (v) 33 33 +150 c +25 c -40 c figure 3. steady state power derating curve figure 4. pulse derating curve 0 25 50 75 100 125 150 175 300 250 200 150 100 50 0 p d , power dissipation (mw) t a , ambient temperature ( c) fr\5 board alumina substrate 100 90 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 175 200 t a , ambient temperature ( c) peak pulse derating in % of peak power or current @ t a = 25 c
mmqa, szmmqa quad common anode series www. onsemi.com 4 typical characteristics figure 5. 10 1000 s pulse waveform value (%) 100 50 0 01234 t, time (ms) t r t p pulse width (t p ) is defined as that point where the peak current decays to 50% of i rsm . t r 10 s half value i rsm 2 peak valuei rsm figure 6. 8 20 s pulse waveform 100 90 80 70 60 50 40 30 20 10 0 020406080 t, time ( s) % of peak pulse current t p t r pulse width (t p ) is defined as that point where the peak current decay = 8 s peak value i rsm @ 8 s half value i rsm /2 @ 20 s figure 7. maximum non?repetitive surge power, p pk versus pw figure 8. typical maximum non?repetitive surge power, p pk versus v z ppk peak surge power (w) 0.1 1.0 10 100 1000 1.0 10 100 power is defined as v rsm x i z (pk) where v rsm is the clamping voltage at i z (pk). pw, pulse width (ms) unidirectional rectangular waveform, ta = 25 c 200 180 160 140 120 100 80 60 40 20 0 5.6 6.8 12 20 33 nominal v z p 27 , peak surge power (w) pk 8 20 waveform as per figure 6 10 100 waveform as per figure 5
mmqa, szmmqa quad common anode series www. onsemi.com 5 typical common anode applications a quad junction common anode design in a sc-74 package protects four separate lines using only one package. this adds flexibility and creativity to pcb design especially when board space is at a premium. a simplified example of mmqa/szmmqa series device applications is illustrated below. keyboard terminal printer etc. functional decoder i/o a mmqa/szmmqa series device gnd b c d figure 9. computer interface protection i/o ram rom clock cpu control bus address bus data bus gnd v gg v dd mmqa/szmmqa se- ries device figure 10. microprocessor protection
mmqa, szmmqa quad common anode series www. onsemi.com 6 device marking and ordering information device* device marking package shipping mmqa5v6t1g 5a6 sc?74 (pb?free) 3,000/tape & reel mmqa6v2t1g 6a2 3,000/tape & reel mmqa6v2t3g 6a2 10,000/tape & reel mmqa6v8t1g 6a8 3,000/tape & reel mmqa12vt1g 12a 3,000/tape & reel mmqa13vt1g 13a 3,000/tape & reel mmqa15vt1g 15a 3,000/tape & reel mmqa18vt1g 18a 3,000/tape & reel mmqa20vt1g 20a 3,000/tape & reel mmqa20vt3g 20a 10,000/tape & reel MMQA22VT1G 22a 3,000/tape & reel mmqa24vt1g 24a 3,000/tape & reel mmqa27vt1g 27a 3,000/tape & reel mmqa27vt3g 27a 10,000/tape & reel mmqa33vt1g 33a 3,000/tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. *includes sz-prefix devices where applicable. mechanical characteristics: case: void?free, t ransfer?molded, thermosetting plastic case. finish: corrosion resistant finish, easily solderable. package designed for optimal automated board assembly. small package size for high density applications. available in 8 mm tape and reel. use the device number to order the 7 inch/3,000 unit reel. replace the ?t1? with ?t3? in the device number to order the 13 inch/10,000 unit reel.
mmqa, szmmqa quad common anode series www. onsemi.com 7 package dimensions sc?74 case 318f?05 issue n 23 4 5 6 d 1 e b e a1 a 0.05 (0.002) notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. 318f?01, ?02, ?03, ?04 obsolete. new standard 318f?05. c l 0.7 0.028 1.9 0.074 0.95 0.037 2.4 0.094 1.0 0.039 0.95 0.037 mm inches scale 10:1 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h e dim a min nom max min millimeters 0.90 1.00 1.10 0.035 inches a1 0.01 0.06 0.10 0.001 b 0.25 0.37 0.50 0.010 c 0.10 0.18 0.26 0.004 d 2.90 3.00 3.10 0.114 e 1.30 1.50 1.70 0.051 e 0.85 0.95 1.05 0.034 0.20 0.40 0.60 0.008 0.039 0.043 0.002 0.004 0.015 0.020 0.007 0.010 0.118 0.122 0.059 0.067 0.037 0.041 0.016 0.024 nom max 2.50 2.75 3.00 0.099 0.108 0.118 h e ? ? l 0 10 0 10 style 1: pin 1. cathode 2. anode 3. cathode 4. cathode 5. anode 6. cathode on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 mmqa/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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